Title:
THICK MATERIAL CUTTING DEVICE AND THICK MATERIAL CUTTING METHOD
Document Type and Number:
Japanese Patent JP3272671
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the environments in which a thick material is cut and post-processed and the capacity to cut a thick material.
SOLUTION: A thick material cutting device 1 comprises a table 3 where a thick corrugated board is laid, a ruler 4 held movable with respect to the table 3, a pressure member 5 for pressing the thick corrugated board on the table 3, a band saw 8 including a planar endless band knife and a spindle motor 7 with an inverter for circulating the band knife perpendicularly to the thick corrugated board, a band saw feed part 9 for moving the band saw 8 in a predetermined direction, a ruler feed part 10 for moving the ruler 4 in the direction perpendicular to the predetermined direction, and an electronic controller 11 for controlling the spindle motor 7, band saw feed part 9 and ruler feed part 10.
Inventors:
Toshinori Ito
Application Number:
JP18824498A
Publication Date:
April 08, 2002
Filing Date:
June 17, 1998
Export Citation:
Assignee:
Kyoritsu Seiki Co., Ltd.
International Classes:
B26D1/46; (IPC1-7): B26D1/46
Domestic Patent References:
| JP8243981A | ||||
| JP522681U | ||||
| JP52129085U | ||||
| JP359197U | ||||
| JP469986Y1 |
Attorney, Agent or Firm:
Takahiro Ozaki
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