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Title:
THICK SUBSTRATE
Document Type and Number:
Japanese Patent JPS6185889
Kind Code:
A
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Inventors:
EGAWA HIDENORI
Application Number:
JP20862084A
Publication Date:
May 01, 1986
Filing Date:
October 04, 1984
Export Citation:
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Assignee:
NEC CORP
International Classes:
H05K3/46; H05K3/12; (IPC1-7): H05K3/12; H05K3/46
Attorney, Agent or Firm:
Uchihara Shin



 
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