Title:
厚み計測装置、及び厚み計測装置を備えた加工装置
Document Type and Number:
Japanese Patent JP7210367
Kind Code:
B2
Abstract:
A thickness measuring apparatus for measuring the thickness of a workpiece held on a chuck table includes the followings: a light source configured to emit white light; an optical branching unit configured to branch, to a second optical path, reflected light applied from the light source to the workpiece held on the chuck table via a first optical path and reflected from the workpiece; a diffraction grating disposed in the second optical path; an image sensor configured to detect an optical intensity signal of light separated into each wavelength by the diffraction grating; and a thickness output unit configured to generate a spectral interference waveform on the basis of the optical intensity signal detected by the image sensor, determine the thickness on the basis of the spectral interference waveform, and output the thickness.
Inventors:
Kimura Nobuyuki
Keiji Nomaru
Keiji Nomaru
Application Number:
JP2019081524A
Publication Date:
January 23, 2023
Filing Date:
April 23, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
G01B11/06
Domestic Patent References:
| JP2012021916A | ||||
| JP2005265655A |
Foreign References:
| WO2016158785A1 | ||||
| US20110205540 |
Attorney, Agent or Firm:
Naozumi Ono
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko
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