To reduce a production cost by integrally molding and sintering an abrasive material layer composed of at least one kind of diamond particles and boron carbide and a matrix alloy to these particles and a base board layer composed of only a matrix alloy.

An abrasive material layer 3 is derived from a base board layer 2 concentrically with the base board layer 2 in an outer peripheral edge pat of the base board layer 2. The particle size of hard particles such as diamond blended with the abrasive material layer 3 of a blade is suitably about 10 to 100 μm. Particularly when a thickness of the blade is 0.3 mm or less, the smaller particle size is preferable. A desirable effect can be imparted when a blending rate of an abrasive material such as diamond blended with the abrasive material layer 3 is about 25% in the volume ratio. A matrix alloy to the diamond is also a constitutive substance of the base board layer 2, and as an example of this alloy, the alloy of 80 wt.% Cu, 20 wt.% Sn or 70 wt.% Cu and 30 wt.% Ni can impart a desirable result.