To provide a thin film bulk wave resonator which can reduce atmospheric pressure difference between a cavity space and open air at a time of sealing without reducing reliability of a stacked resonating body.
The thin film bulk wave resonator 10 is provided with: the stacked resonating body 30; an element substrate 20 with a cavity 22 which offers a space in which the stacked resonating body 30 can freely vibrate in the thickness direction; a cover substrate 60 which is the cover substrate 60 to close an aperture part of the cavity 22, and has a gas passage 63 so as to pass the gas between the cavity 22 and the open air; and a sealing member 80 to seal the stacked resonating body 30, the element substrate 20, and the cover substrate 60. Since the cavity 22 passes to the open air through the gas passage 63, the atmospheric pressure difference does not occur between the cavity space and the open air for all time before and after the sealing process using the sealing member 80. Therefore, break down of the stacked resonating body 30 and deterioration of frequency characteristics by the atmospheric pressure difference between the cavity space and the open air can be suppressed.
KUROKI KOJI
MATSUO YUTAKA
INUBUSHI KAZUMI
AOYANAGI TAKESHI
| JP2006101005A | 2006-04-13 | |||
| JP2002314368A | 2002-10-25 | |||
| JPS6068710A | 1985-04-19 | |||
| JP2010035059A | 2010-02-12 | |||
| JP2006135264A | 2006-05-25 | |||
| JP2004503164A | 2004-01-29 |
Shinji Oga
Toshifumi Onuki
Takuji Fukasawa
Next Patent: APPARATUS AND METHOD FOR RECEIVING ORTHOGONAL FREQUENCY DIVISION MULTIPLEXED SIGNAL