Title:
THIN FILM ELECTRONIC COMPONENT AND SUBSTRATE
Document Type and Number:
Japanese Patent JP3652281
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thin film electronic component and a substrate which can improve the joining strength of an external terminal to a base substrate.
SOLUTION: This component is equipped with the base substrate 1, a lower electrode 5 which is formed partially on the base electrode 1, an insulator layer 3 which is formed on the lower substrate 5, an upper electrode 7 which is formed on the insulator layer 3, a connection electrode 13 which is positioned on the bottom surface of a through hole 23 in the insulator layer 3 and formed on the base substrate 1, the connection electrode which is electrically connected to the lower electrode 5, and the external terminal 11a which is provided to the connection electrode 13 in the through hole 23.
Inventors:
Junya Takafuji
Application Number:
JP2001197241A
Publication Date:
May 25, 2005
Filing Date:
June 28, 2001
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01G4/232; H01G4/30; H01G4/33; (IPC1-7): H01G4/33; H01G4/30
Domestic Patent References:
| JP11097289A | ||||
| JP10233565A |