To enable sufficient removal of product formed on a transfer belt for transferring a wafer in an atmospheric pressure CVD equipment.

The transfer belt 3 which mounts a wafer 2 and transfers it has an endless shape. The transfer belt 3 which passed a film forming chamber 4 and unloaded the wafer 2 on which a thin film is formed passes a scrubber chamber 17, in which solid particles constituted of particle-shaped dry ice are jetted and made to collide against the transfer belt 3; impact is applied to the product on the transfer belt 3 and the product is peeled; or peeling is promoted by making cracks in the product. The transfer belt 3 which passed the scrubber chamber 17 enters a cleaning chamber 6 which removes the product by etching, and the product in a state that peeling is promoted is removed.