To solve a problem wherein a gas sensor package is expanded due to a correction amplifier mounted thereon in a packaging stage in order to compensate for variations in gas detection sensitivity since a thin-film heat sensing body in a thin-film gas sensor hitherto has a problem that the detection sensitivity varies from sensor chip to sensor chip owing to nonuniformity in shape caused by etching.

This thin-film gas sensor is provided with a plurality of thin-film heat sensing bodies on a beam and electrode pads, with these connected to each other by metal thin-film resistors. Nonuniformity in the resistance values of the sensing bodies caused by nonuniformity in etching can be compensated for by selecting the sensing bodies. Accordingly, individual differences can be eliminated by supplementing variations in gas detection sensitivity on sensor chips.

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