To provide a thin film type heat pipe that can be suitably used for electronic equipment of a compact thin film structure.

The thin film type heat pipe is produced by extrusion and comprises a body part having a flat plate shape, a penetration hole formed in a longitudinal direction in the body part, and at least one groove which is formed at least one side of an inner wall side part of the penetration hole and is composed so that a working fluid flows. A relatively large steam flow space can be secured through a portion on which the groove is not formed, and a boundary friction fluidity resistance between a gas and liquid can be reduced. Since the thickness of the film can be thinned to the utmost, it is possible to achieve miniaturization and cost reduction of the structure of a thin film type cooling element.