Title:
THIN HERMETIC PACKAGE
Document Type and Number:
Japanese Patent JP3598967
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thin airtight package which allows its total height to be 0.8 mm or less, without losing its airtightness.
SOLUTION: A metal shell base 1 made of a thin material of about 0.2 mm has a through-hole 2 in which an electrode terminal 4 is insulatively sealed through seal glass 3 extending from the through-hole 2 inside to the periphery of the through-hole 2 on the upper and lower sides of the metal base 1 with steps 102 formed around the periphery of the through-hole 2 on the upper and lower sides of the metal base 1, thereby deciding the extending range of the seal glass 3.
Inventors:
Teruji Matsumoto
Takumi Usui
Eiji Yamagishi
Gennori Oda
Takumi Usui
Eiji Yamagishi
Gennori Oda
Application Number:
JP2000347826A
Publication Date:
December 08, 2004
Filing Date:
November 15, 2000
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L23/02; H01L23/04; H01L23/06; (IPC1-7): H01L23/02; H01L23/04; H01L23/06
Domestic Patent References:
| JP54021295A | ||||
| JP55004158A | ||||
| JP51086379A | ||||
| JP54057163A | ||||
| JP11186425A | ||||
| JP63061815U |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito
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