Title:
薄物インシュレーションボードとその製造方法
Document Type and Number:
Japanese Patent JP6716635
Kind Code:
B2
Abstract:
To provide a thin insulation board reduced in weight and suitable for curing material.SOLUTION: A thin insulation board 1 comprises: an insulation board body 2 with thickness of 3 to 6 mm or less; and a heavily coated layer 5 using aqueous resin liquid coated on one surface of the insulation board body 2. As the aqueous resin liquid is thermoplastic, the heavily coated layer 5 retains characteristics as an insulation board and exhibits an excellent protective character against a local impact and against sand marks when used as a curing material even though it is a thin material.SELECTED DRAWING: Figure 1
Inventors:
Junichiro Ida
Application Number:
JP2018118577A
Publication Date:
July 01, 2020
Filing Date:
June 22, 2018
Export Citation:
Assignee:
Daiken Industry Co., Ltd.
International Classes:
B27K5/04
Domestic Patent References:
| JP4347256A | ||||
| JP2008080714A | ||||
| JP2005111701A | ||||
| JP2001179708A | ||||
| JP55123447A |
Foreign References:
| US20080245493 |
Attorney, Agent or Firm:
Yoshiaki Mori
Maki Ichikawa
Maki Ichikawa