Title:
THIN PLATE LAMINATING DEVICE
Document Type and Number:
Japanese Patent JP3246018
Kind Code:
B2
Abstract:
PURPOSE: To rapidly laminate a plate, a copper foil, an insulation plate and a copper foil in this order.
CONSTITUTION: A first shuttle conveyor is provided right under a first mounting portion 15, a second mounting portion 16 and a third mounting portion 17, and a second shuttle conveyor is provided right under a fourth mounting portion 51, a fifth mounting portion 52 and a sixth mounting portion 53 with a stocking portion 10 interposed. At the upper direction of the stocking portion 10, a third shuttle conveyor is provided, and these and driven up and down and right and left with predetermined timing according to an oblong locus, and each accumulation matter Q of a plate (p) and a copper foil Cu and each accumulation matter R of an insulation plate (s) and a copper foil Cu mounted on each mounting portion are efficiently laminated on the stocking portion 10 in sychronization with the up and down and right and left movements of the third shuttle conveyor.
Inventors:
Keizo Takizawa
Toshinori Mori
Yoshinori Takada
Mitsuo Maehara
Toshinori Mori
Yoshinori Takada
Mitsuo Maehara
Application Number:
JP35103692A
Publication Date:
January 15, 2002
Filing Date:
December 04, 1992
Export Citation:
Assignee:
Shinko Electric Co., Ltd.
International Classes:
B65G47/91; B65G57/03; B65H5/04; B65H29/10; B65H29/16; B65H29/24; B65H29/58; H05K3/02; (IPC1-7): B65H5/04; B65G47/91; B65G57/03; B65H29/10; B65H29/24
Attorney, Agent or Firm:
Yasuo Iisaka