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Patent Searching and Data


Title:
THIN TEMPERATURE FUSE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2006173047
Kind Code:
A
Abstract:

To provide a thin temperature fuse, of which a heating process is reduced while satisfying required characteristics and strength, capable of improving the reliability, and to provide a manufacturing method of the same.

The temperature fuse is composed of a meltable metal 3 that melts by the increase in the temperature, and a conductive plate-shaped body. The plate-shaped body has lead frames 1, 2 constituted of a convex part formed so as to protrude from a surface in a direction crossing the longitudinal direction, and holding parts arranged at short side of the plate-shaped body holding the meltable metal 3, and insulation resin sheets 4, 5. The lead frames 1, 2 are arranged so that the holding parts face each other, and the meltable metal 3 is held and welded by two holding parts. The resin sheet 4 is arranged on the lead frames 1, 2 so as to cover the meltable metal 3 and the convex part, and the resin sheet 5 is arranged on the back face side of the lead frames 1, 2. A space between the resin sheet 4 and the resin sheet 5, including the convex part of the lead frame, is filled by adhesive agent 6.


Inventors:
Katsumoto, Noriyuki
Nakajima, Hiroshi
Fukazawa, Masayuki
Application Number:
JP2004000367431
Publication Date:
June 29, 2006
Filing Date:
December 20, 2004
Export Citation:
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Assignee:
ANZEN DENGU KK
International Classes:
H01H37/76; H01H69/02; H01H37/00; H01H69/00