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Patent Searching and Data


Title:
THIN THERMAL FUSE, METHOD AND APPARATUS OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2006228657
Kind Code:
A
Abstract:

To provide a method of manufacturing a thin thermal fuse which can be easily manufactured by reducing the number of parts, without needing heating process, and to provide an apparatus for manufacturing used for the method of manufacturing and a manufactured thin thermal fuse.

The fusible alloy 1 of a lead conductor 2, where the fusible alloy 1 is formed in a center is located in the recess 3c of a lower mold 3. The lead conductor 2 is located in the channel-like lead conductor arranging parts 3d formed in both sides of the recess 3c. After a resin 8, which will be hardened if UV is irradiated in the recess 3c, after predetermined amount has been dropped, the upper mold 4 which penetrates the UV is put to the upper part of the lower mold 3, and closed. Either at least one of the lower mold 3 and the upper mold 4 is made of the UV-transparent material. The resin 8 is cured by irradiating the UV out of the mold, thereby curing the resin 8, and the inner ends of the fusible alloy 1 and the lead conductor 2 are molded.


Inventors:
Katsumoto, Noriyuki
Nakajima, Hiroshi
Fukazawa, Masayuki
Application Number:
JP2005000043632
Publication Date:
August 31, 2006
Filing Date:
February 21, 2005
Export Citation:
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Assignee:
ANZEN DENGU KK
International Classes:
H01H37/76; H01H69/02