Title:
THIN THERMAL FUSE
Document Type and Number:
Japanese Patent JP3878729
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a thin thermal fuse capable of making very thin such as 400 μm.
SOLUTION: Electrodes 21, 22 are arranged on both sides of a flat case 1, a heat shrinkable insulating film 3 whose one end is fixed is housed in the flat case 1, a low melting point alloy piece 4 is connected to between the electrodes by passing through the heat shrinkable insulating film 3, the low melting point alloy piece 4 is sheared by the heat shrinkage of the heat shrinkable insulating film 3 in the fusion of the low melting point alloy piece 4, and the heat shrinkable insulating film 3 bites into between divided low melting point alloy pieces after being sheared.
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Inventors:
Kawanishi, Toshiaki
Application Number:
JP1997000322394
Publication Date:
November 10, 2006
Filing Date:
November 06, 1997
Export Citation:
Assignee:
UCHIHASHI ESTEC CO LTD
International Classes:
H01H37/76; H01H37/00; (IPC1-7): H01H37/76