PURPOSE: To provide a three-dimensional board in which a reduction in size of an electronically applied device can be expedited and electromagnetic characteristics can be improved.

CONSTITUTION: A socket 12 is disposed at a predetermined position in a board in a three-dimensional manner. Many contact-fixed protrusion contact terminals 22 are provided on an inner surface of the socket 12. Each terminal 22 is formed in shape to be engaged with a recess contact terminal of a semiconductor package, and formed at a position corresponding to disposition of the contact terminal of the package. Wirings 14 in the board connect between the sockets 12 or connect the socket 12 to other board. In order to effectively fix the socket 12 to a predetermined position, a three-dimensional board 10 is sealed with resin 16 except an inner space of the socket 12.