To provide a three-dimensional measuring apparatus capable of quickly performing three-dimensional measurements and inspections while maintaining high measuring accuracy, and of obtaining pattern data comparatively easily.

The three-dimensional measuring apparatus 1 performs three-dimensional measurements of cream solder disposed on a printed board K, based on the measurement of the height of the cream solder. The main control part 7 of the three-dimensional measuring apparatus 1 obtains pattern data about the printed board K and divides the pattern data into a plurality of areas. The main control part 7 sets reference area candidates A1 to A16 for the respective areas C1 to C16 and, based on the contiguous reference area candidates A1 to A16 (reference area candidate A7), performs three-dimensional measurements of the cream solder placed on an inspection pad PD 1.