Title:
THREE-DIMENSIONAL MOLDING DEVICE AND MANUFACTURING METHOD OF THREE-DIMENSIONAL MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2022162070
Kind Code:
A
Abstract:
To provide a molding device capable of producing a three-dimensional molded article with a small void ratio and suppressing reduction of strength of the three-dimensional molded article.SOLUTION: The three-dimensional molding device is equipped with a discharge part for discharging a molding material from an aperture toward a molding table, a move part for changing a relative position of the molding table and the discharge part, and a control part for controlling the discharge part and the move part for molding a three-dimensional molded article, wherein the discharge part is equipped with a tip face having an aperture, the appearance of the aperture is polygon, and the control part controls the move part in a manner that, when molding a three-dimensional molded article, the distance (Gp) between the tip face and a planned section to which the molding material is to be discharged from the discharge part, satisfies the following formula (1). (Sq1×Gp)/Vt<1.0 (1) (Sq1 is an aperture area, Vt is a volume of the molding material which the discharge part discharges per a unit travel.)SELECTED DRAWING: Figure 7
More Like This:
Inventors:
Kenta Anekawa
Application Number:
JP2022133132A
Publication Date:
October 21, 2022
Filing Date:
August 24, 2022
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
B29C64/393; B29C48/505; B29C64/106; B29C64/209; B33Y10/00; B33Y30/00; B33Y50/02
Attorney, Agent or Firm:
Patent Attorney Corporation Meisei International Patent Office