Title:
THREE-DIMENSIONAL MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2023035401
Kind Code:
A
Abstract:
To provide a three-dimensional molding apparatus capable of maintaining positional relationship between a molded object formed on a molding surface and a stage.SOLUTION: A three-dimensional molding apparatus 1 includes: a stage 2 having a first groove 29 and a second groove 31 extending in a first direction 28 on a molding surface 2a; a discharge part 13 for supplying a molding material 3 to the molding surface 2a; a moving mechanism 7 for relatively moving the stage 2 and the discharge part 13; and a control part 4 for controlling the discharge part 13 and the moving mechanism 7. The control part 4: forms a first girder layer 44 by supplying the molding material 3 to a first groove 29 while moving the discharge part 13 relative to the stage 2 in a first direction 28; forms a second girder layer 45 by supplying the molding material 3 to a second groove 31 while moving the discharge part 13 relative to the stage 2 in the first direction 28; and controls the moving mechanism 7 and the discharge part 13 so as to form a first floor layer 46 connecting the first girder layer 44 and the second girder layer 45 by supplying the molding material 3 to the molding surface 2a while moving the discharge part 13 relative to the stage 2.SELECTED DRAWING: Figure 9
Inventors:
SUMIYA AKIHIKO
FUJIMORI YASUSHI
FUJIMORI YASUSHI
Application Number:
JP2021142233A
Publication Date:
March 13, 2023
Filing Date:
September 01, 2021
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B29C64/245; B29C64/106; B29C64/209; B29C64/393; B33Y30/00; B33Y50/02
Attorney, Agent or Firm:
Satoshi Nakai
Hiroki Matsuoka
Masayuki Imamura
Hiroki Matsuoka
Masayuki Imamura
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