Title:
THREE-DIMENSIONAL MOLDING METHOD, THREE-DIMENSIONAL MOLDING APPARATUS AND SUBSTRATE USED THEREFOR
Document Type and Number:
Japanese Patent JP2020012148
Kind Code:
A
Abstract:
To provide a three-dimensional molding method, by which rising or peeling of a molded article from a substrate for mold can be suppressed when a powder containing a ceramic component is used as a molding powder.SOLUTION: The three-dimensional molding method disclosed includes steps of: preparing a molding powder 2 containing at least a ceramic component; preparing a molding support substrate 26 including a molding substrate 26B and a reaction preventing film 26A that is provided in at least a moldable region of the molding substrate 26B and prevents a reaction between the molding powder 2 and the molding substrate 26B; preparing a powder bed by laying the molding powder 2 for mold into a layer on the molding support substrate 26; and making a molded article on the molding support substrate 26 by a powder bed melting and binding system that supplies energy rays to the powder bed.SELECTED DRAWING: Figure 2
Inventors:
IBE HIROYUKI
YAMADA JUNYA
KATO MASAKI
YAMADA JUNYA
KATO MASAKI
Application Number:
JP2018134293A
Publication Date:
January 23, 2020
Filing Date:
July 17, 2018
Export Citation:
Assignee:
FUJIMI INC
AICHI PREFECTURE
AICHI PREFECTURE
International Classes:
B22F3/105; B22F3/16; B33Y10/00; B33Y70/00; C22C33/02
Domestic Patent References:
| JP2016521315A | 2016-07-21 | |||
| JP2013076142A | 2013-04-25 | |||
| JP2000314423A | 2000-11-14 | |||
| JPH0985463A | 1997-03-31 | |||
| JP2018003147A | 2018-01-11 | |||
| JP2019502823A | 2019-01-31 |
Foreign References:
| WO2017108653A1 | 2017-06-29 |
Attorney, Agent or Firm:
Makoto Abe
Michiko Oi
Seiji Tani
Michiko Oi
Seiji Tani