PURPOSE: To facilitate an assembling operation and a repairing operation of a three-dimensional structure electronic component in which electronic components arranged in a vertical direction are interposed between printed circuit boards.

CONSTITUTION: A pair of side plates 13 vertically oppositely disposed and in which the plurality of side plate forming plates 12 formed with grooves 17 to become through holes formed in at least one edge 12a and formed with a circuit pattern 18 are sequentially connected to the edge 12a in a state that the grooves 17 are opposed are provided. A plurality of electronic components 14 disposed over between the pair of side plates 12 in a state that leads 16 extended at both sides of an electronic component body 15 are inserted into through holes formed of the opposed grooves 17 of the adjacent plates 12 of the pair of the plates 13 are fixed to the adjacent plates 12 by filling in the through holes of the side plates, and solders 17a for fixing the leads 16 are provided.