Title:
THREE-DIMENSIONAL WIRING STRUCTURE AND MANUFACTURING METHOD OF THREE-DIMENSIONAL WIRING STRUCTURE
Document Type and Number:
Japanese Patent JP2020068230
Kind Code:
A
Abstract:
To provide a three-dimensional wiring structure having a printed wiring, which can reduce the influence of stress when a base material receives an impact or a load.SOLUTION: There is provided a three-dimensional wiring structure. The three-dimensional wiring structure 1 includes a printed wiring 20 including a three-dimensional area 20d formed three-dimensionally along a curved surface portion 10d of a base material 10, and a stress dispersal section 20e that can disperse the stress received from the base material 10 in the three-dimensional area 20d.SELECTED DRAWING: Figure 1
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Inventors:
SAKA SHINJI
MATSUDA HIROSHI
MATSUDA HIROSHI
Application Number:
JP2018198464A
Publication Date:
April 30, 2020
Filing Date:
October 22, 2018
Export Citation:
Assignee:
LIXIL CORP
International Classes:
H05K1/02; A47K13/30; H05K3/10
Domestic Patent References:
| JP2006196791A | 2006-07-27 | |||
| JP2012084657A | 2012-04-26 | |||
| JP2010075533A | 2010-04-08 | |||
| JP2011062589A | 2011-03-31 | |||
| JP2006173212A | 2006-06-29 | |||
| JPH04137590A | 1992-05-12 | |||
| JP2007061690A | 2007-03-15 | |||
| JP2014003107A | 2014-01-09 |
Foreign References:
| WO2006076609A2 | 2006-07-20 |
Attorney, Agent or Firm:
Sakaki Morishita