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Title:
THREE-DIMENSIONAL WIRING STRUCTURE
Document Type and Number:
Japanese Patent JP2010219424
Kind Code:
A
Abstract:

To provide a three-dimensional wiring structure for easily forming a three-dimensional electronic circuit.

The three-dimensional wiring structure has an electronic component 3 and a wiring pattern 4 each incorporated inside a housing 2, which in turn is constituted by coupling and combining a plurality of segments 5, 6 and 7 in series, the segments 5, 6 and 7 being a pair of end segments 5 and 6 constituting both end parts of the housing 2 and at least one intermediate segment 7 disposed between the pair of end segments 5 and 6. A wall part 71 arranged inside the housing 2 is formed integrally with the intermediate segment 7, the electronic component 3 is mounted on plane wall surfaces 71a and 71b of the wall part 71, and a wiring pattern 4 is formed on each of internal surfaces 50a and 51a, 60a and 61a, and 70a of the wall surfaces 71a and 71b and segments 5, 6 and 7.


Inventors:
SHIMIZU TOSHIYUKI
Application Number:
JP2009066631A
Publication Date:
September 30, 2010
Filing Date:
March 18, 2009
Export Citation:
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Assignee:
OLYMPUS CORP
International Classes:
H05K1/14; H05K1/02; H05K3/32
Domestic Patent References:
JP2004303884A2004-10-28
JPH1117303A1999-01-22
JP2006237276A2006-09-07
JP2005251889A2005-09-15
JP2005217348A2005-08-11
JPH0582710A1993-04-02
JPH04328892A1992-11-17
JP2005210001A2005-08-04
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Suzuki Mitsuyoshi
Tadao Takashiba
Hiroshi Masui