Title:
貫通電極基板
Document Type and Number:
Japanese Patent JP7098902
Kind Code:
B2
Abstract:
To prevent cracking of an insulation film on wiring on a through-electrode substrate.SOLUTION: A through-electrode substrate 104 comprises: a substrate 120 having a first face 140A, a second face 140B, and a through-hole 126 penetrating the first face and the second face; a through-electrode 118 which is provided in the through-hole; and a wiring layer 116, provided on the substrate, which electrically connects the through-electrode to an element 106 provided on the substrate. The wiring layer comprises: first wiring which is provided on the first face; a first insulation film, provided on the first wiring and the first face, which has a step portion corresponding to an end in a first direction of the first wiring; second wiring, provided on the first insulation film, which at least partially overlaps the first wiring when viewed in a direction perpendicular to the first face, and whose distance between the ends in the first direction differs from that of the first wiring; and a second insulation film, provided on the second wiring and the first insulation film, which has a step portion corresponding to an end in the first direction of the second wiring.SELECTED DRAWING: Figure 2
Inventors:
Hiroyuki Asakura
Masashi Sakaki
Masashi Sakaki
Application Number:
JP2017190168A
Publication Date:
July 12, 2022
Filing Date:
September 29, 2017
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L23/12; H01L23/32; H05K3/46
Domestic Patent References:
| JP2016195253A | ||||
| JP2010199386A | ||||
| JP2017017181A |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners
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