Title:
貫通電極基板及びその製造方法、並びに実装基板
Document Type and Number:
Japanese Patent JP7363972
Kind Code:
B2
Abstract:
A manufacturing method of a through electrode substrate includes: a step of preparing a substrate including a first surface and a second surface positioned oppositely to the first surface, and provided with a through hole; a step of providing a sealing layer blocking the through hole on the first surface of the substrate; an electrode forming step of forming a through electrode inside the through hole, the through electrode having a first part extending along a sidewall of the through hole, and a second part connected to the first part and spreading along the sealing layer; and a step of removing the sealing layer.
Inventors:
Hiroshi Kudo
Takano Takano
Takano Takano
Application Number:
JP2022096770A
Publication Date:
October 18, 2023
Filing Date:
June 15, 2022
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L23/12; H01L23/15; H05K1/02; H05K3/42
Domestic Patent References:
| JP2008227433A | ||||
| JP2009117564A | ||||
| JP2016056046A | ||||
| JP2016034030A | ||||
| JP2000138457A | ||||
| JP2010171377A |
Foreign References:
| WO2014069662A1 |
Attorney, Agent or Firm:
Manabu Miyajima
Yukihiro Hotta
Kazuo Okamura
Yukihiro Hotta
Kazuo Okamura