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Title:
区画体の貫通孔処理構造、及び隙間処理部材
Document Type and Number:
Japanese Patent JP7219164
Kind Code:
B2
Abstract:
To provide a through hole processing structure of a compartment body capable of simply eliminating a clearance penetrating a through hole, and a clearance processing member.SOLUTION: A clearance processing member 11 is installed in a through hole Wa of a wall W so as to surround a wiring P. The clearance processing member 11 has a base material 12 that surrounds the wiring P, and also comprises a plurality of block bodies 14 that protrude from the base material 12 in a second direction and are arranged side by side in the direction of surrounding the wiring P. In a through hole processing structure, in order to make a back side of the wall W invisible from a front side through each space H opened between the block bodies 14 adjacent to each other in the direction of surrounding the wiring P, the block bodies 14 are arranged at positions overlapping the space H in a first direction so as to complement each space H.SELECTED DRAWING: Figure 3

Inventors:
Nobukazu Sugihara
Application Number:
JP2019103233A
Publication Date:
February 07, 2023
Filing Date:
May 31, 2019
Export Citation:
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Assignee:
Mirai Industry Co., Ltd.
International Classes:
F16L5/10; A62C3/16; E04B1/94; F16L5/02; F16L5/04; H02G3/22
Domestic Patent References:
JP2008241027A
JP2000334058A
JP2016223190A
JP2016187398A
JP6007755U
JP2004169922A
JP2010255792A
JP2004340245A
JP2016165356A
Foreign References:
WO2013145790A1
WO2010067637A1
EP1273841A1
DE20017115U1
DE102004007700A1
CN204459484U
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda



 
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