Title:
TILE ARRANGING PALLET
Document Type and Number:
Japanese Patent JP3545648
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a tile arranging pallet suitable for connecting adjacent tiles arranged in specified arrangement to each other using bond as a tile connecting means instead of a paper sheet.
SOLUTION: Bond B is preliminarily applied to communication parts 16, 17 in a pallet 10, and tiles T are placed in sections 14 one by one, setting their back side downward. Plurality of the tiles T are arranged in specified arrangement, that is six vertically and three laterally, and the bond B is spread between the adjacent sections 14 through the communication parts 16, 17 to be applied to the tiles T are placed in the respective sections 14, thereby the adjacent tiles T are connected to each other by the bond B.
Inventors:
Ichiichi Asano
Application Number:
JP17199999A
Publication Date:
July 21, 2004
Filing Date:
June 18, 1999
Export Citation:
Assignee:
Bundou Co., Ltd.
International Classes:
E04F13/08; B28B11/00; (IPC1-7): E04F13/08
Domestic Patent References:
| JP52141834U |
Attorney, Agent or Firm:
Hajime Miyake