Title:
TIN OR TIN ALLOY PLATING MATERIAL FOR TERMINAL CONNECTOR OF ELECTRONIC DEVICE, ELECTRIC PARTS, ETC., WITH SUPERIOR SURFACE CONTACT RESISTANCE CHARACTERISTICS AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3263229
Kind Code:
B2
Abstract:
PURPOSE: To obtain superior surface contact resistance characteristics by setting a specific value for the peak area ratio of PC (2p)/Sn (3d) of a plating surface obtained by X-ray photoelectric spectroscopy in a plating surface formed by applying tin or tin alloy plating on a copper or copper alloy.
CONSTITUTION: Tin or tin alloy plating is applied on copper or copper alloy. The plating surface of the tin or tin alloy plating material is formed so that the peak area ratio of P (2p)/Sn (3d) on the tin or tin alloy plating surface obtained by X-ray photoelectric spectroscopy may be 0.03 to 0.05. If the peak area ratio is less than 0.003, the film is incomplete and oxydation of Sn may probably advance. On the other hand, if it exceeds 0.05, the film becomes thicker, and the contact resistance value on the plated surface may probably increase. The peak area of P (2p)/Sn (3d) can be controlled according to a electrolyzing time. When the electrolyzing time is longer or shorter, the peak area ratio of P (2p)/Sn (3d) is increased or decreased, respectively.
More Like This:
| JPH0497966 | PRODUCTION OF CERAMIC SLIDING PARTS |
| JP3744972 | Solder joining method |
Inventors:
Satoshi Maruo
Masaaki Isono
Masaaki Isono
Application Number:
JP3996794A
Publication Date:
March 04, 2002
Filing Date:
March 10, 1994
Export Citation:
Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO
International Classes:
B23K1/20; C25D5/26; C25D7/00; H01R13/03; (IPC1-7): C25D7/00
Domestic Patent References:
| JP4314897A | ||||
| JP5292837A | ||||
| JP6396293A | ||||
| JP132308B2 | ||||
| JP136558B2 |
Attorney, Agent or Firm:
Yoshiyuki Kaji