Title:
TIN-BISMUTH BASED ALLOY PLATING BATH
Document Type and Number:
Japanese Patent JP3481020
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To form an Sn-Bi based alloy plated film with the wide range of current density by composing an Sn-Bi based alloy plating bath so as to contain a specific metal ion and a specific acid and not to contain lead ion.
SOLUTION: The bath jointly using one or more kind selected from Cu, Co and Ag with an Sn-Bi alloy plating composition as third components and coexisting with a specific acid is used. That is, at least one kind of a metal ion selected from each ion of Bi, Sn, Co, Ag is incorporated in the Sn-Bi alloy plating bath. The Sn-Bi alloy plating bath is composed so as to contain at least one kind selected from among a carboxylic acid, a lactone compound, an alkanesulfonic acid, an alkanolsulfonic acid, a phenolsulfonic acid and the salts thereof and not to substantially contain lead ion. The Bi content is controlled to 0.1-75wt.%. The pH of the plating bath is controlled to 2-9. Thus, a material to be plated such as a ceramic, a lead glass, a plastics is plated without corroding the base material.
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Inventors:
Hitoshi Sakurai
Ayumu Saito
Mayumi Date
Nagatake Mita
Ayumu Saito
Mayumi Date
Nagatake Mita
Application Number:
JP22998195A
Publication Date:
December 22, 2003
Filing Date:
September 07, 1995
Export Citation:
Assignee:
Dipsole Co., Ltd.
International Classes:
C25D3/56; C25D3/60; B23K1/20; H05K3/34; (IPC1-7): C25D3/56
Domestic Patent References:
| JP71179A | ||||
| JP7138782A | ||||
| JP827590A | ||||
| JP535034A | ||||
| JP765207B2 |
Other References:
【文献】ソ連国特許発明1191492(SU,A)
Attorney, Agent or Firm:
Minoru Nakamura (7 outside)
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