Title:
Tin-plated copper terminal material and terminal and wire terminal structure
Document Type and Number:
Japanese Patent JP6304447
Kind Code:
B2
Abstract:
On a base member 2 made of copper or a copper alloy, a zinc-nickel alloy layer 4 including zinc and nickel, and a tin layer 5 made of tin alloy are laminated in this order: the zinc-nickel alloy layer 4 has a thickness of 0.1-5 µm inclusive and has a nickel content of 5-50 mass% inclusive, the tin layer 5 has a zinc concentration of 0.6-15 mass% inclusive, and, under an oxide layer 6 which is the outermost layer, a metal zinc layer 7, having a zinc concentration of 5-40 at% inclusive and a thickness of 1-10 nm inclusive in SiO 2 conversion, is formed on the tin layer 5.
Inventors:
Kenji Kubota
Keiya Tarutani
Kiyotaka Nakaya
Keiya Tarutani
Kiyotaka Nakaya
Application Number:
JP2017513159A
Publication Date:
April 04, 2018
Filing Date:
November 24, 2016
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
C25D7/00; C23C10/28; C25D5/12; C25D5/14; C25D5/50; H01R13/03
Domestic Patent References:
| JP2000144482A | ||||
| JP2009084616A | ||||
| JP2016169439A | ||||
| JP2013033656A | ||||
| JP2013243106A |
Foreign References:
| WO2014177563A1 |
Attorney, Agent or Firm:
Masakazu Aoyama