Title:
TIN-SILVER ALLOY ELECTROPLATING BATH
Document Type and Number:
Japanese Patent JP3538499
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a plating film excellent in nonlead solderability by specifying the component of a plating soln.
SOLUTION: This plating soln. contains the noncyan compd. of tin(II) and the noncyan compd. of silver(I), a compexing agent to stably dissolve and keep the tin(II) compd. in a bath and a complexing agent for stably dissolving silver ion in the bath and suppressing the priority deposition of silver, and at least one kind of surfactant is added. The surfactant participates in the electrodeposition close to the electrode surface to suppress the deposition of metal and to micronize the electrodeposited alloy crystal. By using such a noncyan plating soln., a plating film of nonlead solderability is obtained instead of the tin-lead soldering liable to cause troubles in environmental sanitation.
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Inventors:
Masaki, Seiji
Kondo, Tetsuya
Nawafune, Hidemi
Kondo, Tetsuya
Nawafune, Hidemi
Application Number:
JP14348196A
Publication Date:
June 14, 2004
Filing Date:
May 15, 1996
Export Citation:
Assignee:
DAIWA KASEI KENKYUSHO:KK
International Classes:
C25D3/56; C25D3/60; (IPC1-7): C25D3/56; C25D3/60