Title:
TIRE-MOLDING DIE
Document Type and Number:
Japanese Patent JP3091363
Kind Code:
B2
Abstract:
PURPOSE: To obtain a tire-molding die that can be easily and rapidly cleaned and assembled.
CONSTITUTION: A segment 5 is formed by fitting a plurality of pieces 10 to a holder sector 20. Peripheral grooves 22 are formed in a holding surface 21 of the holder sector 20. A stopper 30 is provided in the peripheral groove 22 in position. A positioning pin is projected on the back surface of the piece 10. The piece 10 is positioned with respect to the holder sector 20 by abutting the positioning pin against the stopper provided in the peripheral groove 22 in position.
Inventors:
Toshiaki Ishihara
Application Number:
JP14997694A
Publication Date:
September 25, 2000
Filing Date:
June 30, 1994
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B29C33/38; B29C33/02; B29C33/42; B29C35/02; B29D30/06; B29C33/10; B29C33/30; (IPC1-7): B29C33/38; B29C33/02; B29C35/02
Domestic Patent References:
| JP59218831A | ||||
| JP538720A | ||||
| JP2295706A | ||||
| JP6106539A | ||||
| JP4223108A | ||||
| JP6155475A | ||||
| JP5220753A | ||||
| JP334810A | ||||
| JP217311U |
Attorney, Agent or Firm:
Ippei Watanabe
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