Title:
タイヤ研磨装置及び研磨方法
Document Type and Number:
Japanese Patent JP7230575
Kind Code:
B2
Abstract:
To provide a tire polishing device and a polishing method, which can contribute to an improvement in productivity of tire.SOLUTION: A tire polishing device 22 comprises: a rim part 24 for holding a tire 2; a rotary part 26 for rotating the rim part 24; an encoder 28 for measuring an angle of rotation of the rim part 24; an adjustment part 32 for adjusting a position of a grinding stone 48 with respect to the tire 2; an image sensor 36 for observing a polished state of a raised area; and a determination part 76 for determining whether the polished state of the raised part is right or wrong, on the basis of the polished state of the raised area, observed by the image sensor 36.SELECTED DRAWING: Figure 1
Inventors:
Shoji Murayama
Application Number:
JP2019028359A
Publication Date:
March 01, 2023
Filing Date:
February 20, 2019
Export Citation:
Assignee:
Sumitomo Rubber Industries, Ltd.
International Classes:
B24B19/22; B24B7/16; B24B41/06; B24B49/02; B24B49/12; B29D30/00
Domestic Patent References:
| JP5277925A | ||||
| JP2008128790A | ||||
| JP2001287162A | ||||
| JP2008137309A |
Foreign References:
| EP3269569A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Suncrest International Patent Office
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