Title:
タイヤ空気圧モニターパッケージングの方法
Document Type and Number:
Japanese Patent JP7410986
Kind Code:
B2
Abstract:
A packaging method for a tire pressure monitoring sensor includes a step of placing, a step of pouring, and a step of hardening. In the step of placing, a sensing transmission module is put into a cavity of a modeling unit, and a positioning portion in the cavity restricts the sensing transmission module from moving transversely and toward an inner bottom of the cavity. In the step of pouring, a rubber compound is poured into the cavity and fills the cavity. The sensing transmission module is coated by the rubber compound to form a case on the outer surface of the sensing transmission module. In the step of hardening, the case is hardened and integrally formed with the sensing transmission module to form a tire pressure monitoring sensor which is removed from the cavity.
Inventors:
Lee Seong-ho
Hayashi
Hayashi
Application Number:
JP2022011335A
Publication Date:
January 10, 2024
Filing Date:
January 27, 2022
Export Citation:
Assignee:
SYSGRATION LTD.
International Classes:
B60C23/04; B60C19/00
Domestic Patent References:
| JP2005186658A | ||||
| JP2006015925A | ||||
| JP2006027390A |
Foreign References:
| TW201823700A | ||||
| CN101927669B | ||||
| CN101944514B |
Attorney, Agent or Firm:
SK Patent Attorney Corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito