Title:
TITANIUM COPPER FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2016145424
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an excellent balance of strength and ductility to a titanium copper by controlling a grain boundary reaction phase.SOLUTION: There is provided titanium copper for electronic component containing Ti of 2.0 to 4.0 mass%, one or more kind selected from a group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and P as a third element of total 0 to 0.5 mass%, and the balance copper with inevitable impurities and having percentage of length of a grain boundary reaction phase occupying a grain boundary to the total grain boundary length of 5 to 40% in a structure observation of a cross section parallel to a rolling direction and average value of aspect ratio of the grain boundary reaction phase represented by b/a of 0.1 to 0.8, where a is length along with the grain boundary for each grain boundary reaction phase and b is length in a direction into a grain.SELECTED DRAWING: Figure 1
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Inventors:
HORIE HIROYASU
Application Number:
JP2016051588A
Publication Date:
August 12, 2016
Filing Date:
March 15, 2016
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C22C9/00; H01B1/02
Attorney, Agent or Firm:
Axis International Patent Business Corporation
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