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Patent Searching and Data


Title:
LEAD FRAME STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD OF CUTTING
Document Type and Number:
Japanese Patent JPH0722555
Kind Code:
A
Abstract:

PURPOSE: To provide a lead frame structure which does not provide any chip when a tie-bar is cut and also a high cutting precision for cutting of tie-bar and a method of cutting the same.

CONSTITUTION: A tie-bar 2 of lead frame 4 includes almost the center area 2b of both leads 3 coupled which is narrower than the lead boundary area 2a. The tie-bar is cut only at the center area 2b and is then separated to both sides from this cutting area. Thereby, since any chip is generated and the cutting area is narrower than the other tie-bar portion, if the cutting position is deviated, the narrower center area may be cut easily, requiring no higher precision for the cutting operation.


Inventors:
TAKAHASHI YOSHIHARU
Application Number:
JP18863093A
Publication Date:
January 24, 1995
Filing Date:
July 02, 1993
Export Citation:
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Assignee:
SONY CORP
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Attorney, Agent or Firm:
Mitsuo Takahashi