Title:
【発明の名称】電子部品自動装着装置
Document Type and Number:
Japanese Patent JP2620646
Kind Code:
B2
Abstract:
An improved apparatus for automatically mounting electronic components wherein a take-out nozzle is rotated by a nozzle rotating unit based on data on an angular position assumed by each chip-shaped electronic component firmly held on the take-out nozzle in order to perform a correcting operation so as to allow the electronic component to assume an adequate angular position and, after completion of the correction operation, the respective electronic components are mounted on a printed-circuit board is disclosed. The apparatus includes a storing unit in which an allowable error range is stored, a comparing unit for determining whether or not the present angular positions assumed by the respective electronic components and recognized by a recognized unit remain within the allowable error range, and a controlling unit for controlling the nozzle rotating unit so as to allow a correcting operation to be repeatedly performed based on results derived from the determination made by the comparing unit, until the respective recognized angular positions remain within the allowable error range.
Inventors:
Kazunori Takada
Tsunefumi Akaishi
Masayuki Mobara
Tsunefumi Akaishi
Masayuki Mobara
Application Number:
JP11897590A
Publication Date:
June 18, 1997
Filing Date:
May 08, 1990
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H05K13/04; H05K13/08; (IPC1-7): H05K13/04
Domestic Patent References:
| JP1122200A | ||||
| JP115998A |
Attorney, Agent or Firm:
Koji Yasutomi (1 person outside)