Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMAL HEAD
Document Type and Number:
Japanese Patent JPS6013565
Kind Code:
A
Abstract:

PURPOSE: To attain to enhance the anti-wear property and heat conductivity of a polyimide resin used in the protective film of a thermal head, by forming the protective film of a heat generator from the polyimide resin in which a filler comprising a predetermined material is contained in a required wt. ratio.

CONSTITUTION: Fine particles with high hardness comprising silicon carbide or alumina are contained in a polyimide resin for forming the protective layer 4 provided to the heat generator layer 2 of a thermal head as a filler in an amount of 20W50% by wt. of the polyimide resin. Because this polyimide resin is used, high temp. baking can be performed and the anti-wear property and heat conductivity of the polyimide resin used in the protective film of the thermal head is enhanced while the enhancement in printing quality over a long period of time can be achieved.


Inventors:
KANAMORI TAKASHI
SHIBATA SUSUMU
SAWAI HIDEO
KUROKI KENJI
Application Number:
JP12108683A
Publication Date:
January 24, 1985
Filing Date:
July 05, 1983
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01C7/00; B41J2/335; H01L49/00; H05B3/10; (IPC1-7): B41J3/20; H01C7/00; H01L49/00
Attorney, Agent or Firm:
Keiichi Yamamoto



 
Previous Patent: Vehicle speed control device

Next Patent: JPS6013566