PURPOSE: To easily and accurately form an electric circuit or an electric circuit section by providing a transfer section and a plurality of conductive projections not located on the same straight line.

CONSTITUTION: Three or more conductive projections 11 having the taper angle of 20° or below and not located on the same straight line are provided on a transfer section 1 having a low-melting point metal layer on the surface to obtain a transferring conductive bump B. The transfer section 1 of the conductive bump B of a conductive bump transfer base material is brought into contact with the electrode section of an object to be transferred, the conductive bump B is heat-pressed to the electrode section 4, then the carrier of the conductive bump transfer base material is peeled from the conductive bump B, and the conductive bump B is transferred and formed on the object to be transferred.