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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION SUITABLE FOR SEALING ELEMENT
Document Type and Number:
Japanese Patent JPS6035018
Kind Code:
A
Abstract:

PURPOSE: The titled composition freed from a need of film sheet application and a problem of peeling, breaking, etc., of a film and improved in transmittance, prepared by adding a visible light-absorbing coloring agent to an acid anhydridecurable epoxy resin composition.

CONSTITUTION: A resin composition suitable for sealing infrared ray-emitting and/or receiving elements, prepared by adding 0.01W5wt% visible light-absorbing coloring agent to a transparent resin comprising an epoxy resin, a cure accelerator, a lubricant and an acid anhydride curing agent. Heretofore, when a sealed body is used for infrared ray-emitting and/or receiving, a film for screening visible light is applied to the sealed body. In this case, there have been problems such as peeling or breaking of a film sheet, and an additional step of film application. By adding a visible light-absorbing coloring agent, the above problems can be eliminated, visible light can be screened, and the transmittance in the near infrared and infrared regions can be improved.


Inventors:
INOUE OSAMU
KAKEHI MITSUO
Application Number:
JP14259283A
Publication Date:
February 22, 1985
Filing Date:
August 05, 1983
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K3/00; C08G59/00; C08G59/42; C08L63/00; H01L23/29; H01L23/31; H01L33/56; (IPC1-7): C08G59/42; C08K3/00; C08L63/00; H01L23/30; H01L33/00
Domestic Patent References:
JPS5771155A1982-05-01
JPS58118164A1983-07-14
JPS5779678A1982-05-18