Title:
【発明の名称】ボンデイングヘツド
Document Type and Number:
Japanese Patent JP2835983
Kind Code:
B2
Abstract:
A bonding head assembly including a retaining block having a vacuum suction hole or electromagnet on its concave surface formed on the undersurface, a central shaft loosely passing through the central hole of the retaining block and having a bonding tool at the lower end, an oscillating ball attached to the upper part of the central shaft. After the bonding tool is brought into in contact with a workpiece, vacuum suction or electromagnet is activated so that the oscillating ball is brought into a tight contact with the concave surface of the retaining block, thus securely retaining the oscillating ball in the retaining block and, as a result, setting the position of the central shaft and therefore the bonding tool.
Inventors:
OZAWA KANJI
SONODA YUKITAKA
SONODA YUKITAKA
Application Number:
JP29508990A
Publication Date:
December 14, 1998
Filing Date:
October 31, 1990
Export Citation:
Assignee:
SHINKAWA KK
International Classes:
H01L21/60; B23K20/02; (IPC1-7): H01L21/60
Domestic Patent References:
| JP63200541A | ||||
| JP494552A | ||||
| JP2234448A | ||||
| JP1143129U | ||||
| JP6365224U |
Attorney, Agent or Firm:
Yoshinori Tanabe