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Title:
【発明の名称】回路基板装置及びその製造方法
Document Type and Number:
Japanese Patent JP2865054
Kind Code:
B2
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Inventors:
YOSHIZAKI SHIGEO
Application Number:
JP10619696A
Publication Date:
March 08, 1999
Filing Date:
April 03, 1996
Export Citation:
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Assignee:
SANKEN DENKI KK
International Classes:
H01L23/12; H05K1/16; H05K3/28; (IPC1-7): H05K3/28; H05K1/16
Domestic Patent References:
JP60143691A
JP8125305A
Attorney, Agent or Firm:
Takano Noritsuji



 
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