Title:
【発明の名称】複合電気接点構造及びその製造方法
Document Type and Number:
Japanese Patent JP2003524749
Kind Code:
A
Abstract:
An improved wear resistant bump contact is produced by the inclusion of small particles of hard materials in the conductive material of the contact bump, preferably by co-deposition at the time of electroplating of the bump bulk material. Desirable attributes of the small particles of hard material include small particle size, hardness greater than the hardness of the bulk material of the contact bump, compatibility with the plating conditions, and electrical conductivity. Nitride, borides, silicides, carbides are typical interstitial compounds suitable for use in satisfying these desirable attributes. In one preferred example, a nickel bulk material and silicon carbide particles are utilized. In one variation, the bump of metal-particle co-deposited material is coated by a thin cap layer of noble, non-oxidizing metal to prevent electrical erosion by arcing as contact is made and broken from the pad. Rhodium and ruthenium are suitable metals and can be electrodeposition over the composite bump structure.
More Like This:
| WO/2023/098119 | COMPLIANT WAFER PROBE ASSEMBLY |
| WO/2002/010784 | NOTCHED ELECTRICAL TEST PROBE TIP |
Inventors:
Nanis Leonard
Scientific Detectors Limited
Scientific Detectors Limited
Application Number:
JP2000504590A
Publication Date:
August 19, 2003
Filing Date:
July 08, 1998
Export Citation:
Assignee:
Daitac Corporation
International Classes:
G01R1/067; G01R1/073; G01R3/00; H01L21/60; H05K3/00; H01L21/66; H05K3/40; H05K3/24; H05K3/42; (IPC1-7): G01R1/073; H01L21/66; H05K3/00
Attorney, Agent or Firm:
Minoru Nakamura (9 outside)