Title:
【発明の名称】冷却モジュール
Document Type and Number:
Japanese Patent JP3085438
Kind Code:
B2
Abstract:
The cooling module includes a base plate, a number of thermally conductive plates affixed to the base plate and arranged parallel to each other, for defining fluid flow path. A circuit module carrier is coupled to an opposite side of the base plate to form a sealed enclosure with the base plate an a thermally conductive contact with cups of circuit modules within the enclosure. The module also incorporates a flow path dividing plate disposed perpendicular to the plates so as to define at least two distinctive floe paths through the conductive plates. A set of two shrouds is includes, e.g. one of the shrouds is for directing the fluid flow in one direction in one of the paths.
Inventors:
Deleger agonafer
Timothy Merrill Anderson
Gregory Martin Chrysler
Richard Chao Fanchu
Robert Edward Simons
David Theodor Vader
Timothy Merrill Anderson
Gregory Martin Chrysler
Richard Chao Fanchu
Robert Edward Simons
David Theodor Vader
Application Number:
JP13249894A
Publication Date:
September 11, 2000
Filing Date:
May 24, 1994
Export Citation:
Assignee:
International Business Machines Corporation
International Classes:
F28F7/00; H01L23/467; H01L23/473; (IPC1-7): F28F7/00; H01L23/473
Domestic Patent References:
| JP3276788A | ||||
| JP5961150A | ||||
| JP521490U | ||||
| JP6223091Y2 | ||||
| JP4822666B1 |
Attorney, Agent or Firm:
Hiroshi Sakaguchi (1 person outside)