Title:
LEAD FRAME MATERIAL FOR LIGHT EMITTING DIODE
Document Type and Number:
Japanese Patent JPH0711364
Kind Code:
A
Abstract:
PURPOSE: To eliminate season cracking and to eliminate the need of plating by incorporating specified amounts of one or more kinds among Cr, Zr, Al, Y and Ti into a Cu-Zn alloy having a specified compsn.
CONSTITUTION: A lead frame material for a light emitting diode is constituted of a compsn. of, by weight, 10 to 45% Zn and at least one kind selected from the group of Cr, Zr, Al, Y and Ti, and the balance Cu. At the time of adding 0.05 to 2.5% of one or more kinds among Si, Ge and Fe to the material compsn. according to necessary, its hot workability can be improved. This material is excellent in strength and good in reflectance.
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Inventors:
TEJIMA KOICHI
NAKAMURA SHINICHI
HATANAKA TATSUYA
HAYASHI MASARU
ICHIKAWA MEGUMI
MATSUMOTO IWAO
NAGASAWA YUTAKA
FUJIMORI YOSHINORI
NAKAMURA SHINICHI
HATANAKA TATSUYA
HAYASHI MASARU
ICHIKAWA MEGUMI
MATSUMOTO IWAO
NAGASAWA YUTAKA
FUJIMORI YOSHINORI
Application Number:
JP15877393A
Publication Date:
January 13, 1995
Filing Date:
June 29, 1993
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
C22C9/04; (IPC1-7): C22C9/04
Attorney, Agent or Firm:
Takehiko Suzue
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