METHOD AND METAL MOLD FOR RESIN MOLDING OF THIN SUBSTRATE

Title:

METHOD AND METAL MOLD FOR RESIN MOLDING OF THIN SUBSTRATE

Document Type and Number:

Japanese Patent JPH0699451

Kind Code:

A

Abstract:

PURPOSE: To provide the resin molding method and the resin molding metal mold for a thin substrate, which can remove air from a cavity smoothly and positively and can readily mold the thin substrate having the excellent quality.

CONSTITUTION: Fused resin, which is injected into a cavity 18 from a part corresponding to the central part of an optical disk substrate (thin substrate), is circulated toward a part corresponding to the outer surface of the optical disk substrate. At this time, air in the cavity 18 is pushed out through an air vent 19, which is provided at a part corresponding to the outer surface of the optical disk substrate. Therefore, the air does not remain in the cavity 18, and the inside of the cavity 18 is uniformly filled with the resin.

Inventors:

TAKEDA YOSHINOBU

Application Number:

JP25012292A

Publication Date:

April 12, 1994

Filing Date:

September 18, 1992

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP

International Classes:

B29C33/10; B29C45/00; B29C45/26; B29C45/34; B29L17/00; (IPC1-7): B29C45/00; B29C33/10; B29C45/34

Attorney, Agent or Firm:

Masatake Shiga (2 outside)

Next Patent: MANUFACTURE OF URETHANE-REACTION INJECTION MOLDED PRODUCT