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Title:
COVER TAPE FOR ELECTRONIC PART CARRIER
Document Type and Number:
Japanese Patent JPH068958
Kind Code:
A
Abstract:

PURPOSE: To prevent electronic parts from contamination with adhesive agent by a method wherein the cover tape for covering the part storing recess part provided in the carrier tape is formed on a supporting base plate together with pressure-sensitive adhesive layer and an intermediate part of the adhesive layer confronting the part storing recess part is made a specific part free from stickiness.

CONSTITUTION: Paper-made carrier tape 1 is provided with electronic part storing holes 11 at predetermined intervals, a lower cover tape C1 is attached to the underside of the carrier tape 1, an electronic part (a) is placed in the hole 11 and an upper cover tape C2 is thereafter attached to the carrier tape. In the cover tapes CL and C2 thus used, a pressure-sensitive adhesive layer 4 free from optical initiator and mixed with photosensitizing polymerizable substance is formed on one side in contact with the tape 1 of supporting base plate 3. In order to make an intermediate part of the adhesive layer 4 confronting the hole 11 of the tape 1 free from stickiness, a coat of an optical initiator containing photosensitizing polymerizable material 5 is applied to the adhesive layer, whereby the photosensitizing polymerizable materials of the adhesive layer 4 and the material 5 are bridged at an interface (b) by dispersion and shifting of the optical initiator.


Inventors:
HANAI TAKAOMI
OKUNO TOSHIMITSU
OSHIMA TOSHIYUKI
KAKIMOTO WATARU
ICHIKAWA HIROKI
Application Number:
JP19325292A
Publication Date:
January 18, 1994
Filing Date:
June 26, 1992
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
B65D73/02; (IPC1-7): B65D73/02
Attorney, Agent or Firm:
Matsukatsu Mikatsu



 
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