PURPOSE: To enable flat coating of resist on semiconductor substrates having ruggedness as well by disposing the rotatable semiconductor substrates on the outside circumference of a rotating body and applying large centrifugal force perpendicularly to the substrate surface.

CONSTITUTION: A rotating body 11 is provided rotatably by means of a motor 15 via a shaft body 14 and plural pieces of rotary tables 17 to which semiconductor substrates 18 are fixed and held are fitted to the outside circumferential part thereof. The rotating body is connected via a gear 19 to a suitable gear. Resist is ejected to the substrates 18 from a central resist supply pipe 20. The centrifugal force which acts perpendicularly to the substrate surfaces and has the magnitude of 10-fold the force acting in the horizontal direction is applied to said substrate surfaces if the rotating ratio between the body 11 and the tables 17 is adequately set, by which the resist is coated flatly on the surfaces of the substrates having ruggedness and the device is satisfactorily adaptable to formation of sub-micron patterns.