Title:
COPPER-TIN ALLOY PLATING BATH
Document Type and Number:
Japanese Patent JPS5920488
Kind Code:
A
Abstract:
PURPOSE:To improve the stability of a Cu-Sn alloy plating bath contg. copper cyanide and potassium stannate and to enable uniform bright alloy plating, by adding a thiocyanate, polyethyleneimine and a nickel salt to the plating bath as a brightener. CONSTITUTION:In a Cu-Sn alloy plating bath contg. copper cyanide and an alkali stannate, potassium stannate is used as the stannate, and to the bath are added a thiocyanate, polyethyleneimine and a nickel salt as a brightener. Thus, a superior Cu-Sn alloy plating bath preventing the precipitation of metastannic acid, having superior stability and enabling uniform bright plating can be obtd. The current density range of the bath for bright plating is extended.
Inventors:
IKENO HIROSHIGE
OGAWA KENICHI
OGAWA KENICHI
Application Number:
JP13058782A
Publication Date:
February 02, 1984
Filing Date:
July 27, 1982
Export Citation:
Assignee:
SEIKO INSTR & ELECTRONICS
International Classes:
C25D3/60; (IPC1-7): C25D3/60
Attorney, Agent or Firm:
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