Title:
【発明の名称】硬化性組成物
Document Type and Number:
Japanese Patent JP2555153
Kind Code:
B2
Abstract:
A curable polymer composition comprising: (A) 100 parts by weight of an oxyalkylene base polymer having at least one silicon-containing group to the silicon atom of which a hydroxy group and/or a hydrolyzable group is bonded and which is cross linkable through formation of a siloxane bond, (B) 0.1 to 20 parts by weight of at least one compound selected from the group consisting of a compound having one silanol group in a molecule and a compound which, when reacted with moisture, generates a compound having one silanol group in a molecule, (C) 0.1 to 20 parts by weight of a compound having a silicon-containing group to the silicon atom of which two hydrolyzable groups are bonded and an amino group, and (D) 0.01 to 5 parts by weight of a compound having a silicon-containing group to the silicon atom of which three hydrolyzable groups are bonded and an amino group, which composition provides a cured material having low modulus, good bond strength and improved weather resistance of bond strength. p
Inventors:
YUKIMOTO SADAO
HIROSE TOSHIBUMI
WAKABAYASHI HIROSHI
ISAYAMA KATSUHIKO
HIROSE TOSHIBUMI
WAKABAYASHI HIROSHI
ISAYAMA KATSUHIKO
Application Number:
JP14401588A
Publication Date:
November 20, 1996
Filing Date:
June 10, 1988
Export Citation:
Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C08K5/54; C08G65/336; C08L71/02; (IPC1-7): C08L71/02; C08K5/54
Domestic Patent References:
| JP57182350A |
Attorney, Agent or Firm:
Sota Asahina (1 person outside)